This PCB is a high-performance 3-layer printed circuit board made from advanced materials, specifically RO4003C and RO4450F. It is designed for precision and reliability, meeting stringent specifications to ensure optimal electrical performance and mechanical stability.
PCB details
| Parameter | Specification |
| Base Material | RO4003C / RO4450F |
| Layer Count | 3 Layers |
| Board Dimensions | 291mm x 155mm ± 0.15mm (2 Types, 2 PCS) |
| Minimum Trace/Space | 5/4 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | Top Layer to Inner Layer 1 |
| Finished Board Thickness | 1.82mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers / 1oz inner layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Black |
| Bottom Solder Mask | No |
| Electrical Testing | 100% electrical test used prior to shipment |
The stack-up of this 3-layer rigid PCB is structured as follows:
- Copper Layer 1: 35 μm
-Rogers 4003C Core: 0.813 mm (32 mil)
- Copper Layer 2: 35 μm
- Bonding Ply: RO4450F - 0.102 mm (4 mil)
- Rogers 4003C Core: 0.813 mm (32 mil)
- Copper Layer 3: 35 μm
Artwork and Quality Standards
The artwork supplied is in the Gerber RS-274-X format, adhering to IPC-Class-2 quality standards. This ensures that the PCB meets industry requirements for reliability and performance.
Global Availability
This high-performance PCB is available worldwide, making it accessible for various applications across different markets.
Introduction to RO4003C
Rogers RO4003C is a proprietary material known for its excellent electrical performance. It combines the benefits of PTFE/woven glass with the manufacturability of epoxy/glass, offering a cost-effective solution for microwave laminates. Key features include:
- Dielectric Constant (Dk): 3.38 ±0.05 at 10GHz
- Dissipation Factor: 0.0027 at 10GHz and 0.0021 at 2.5GHz
- Thermal Coefficient of Dielectric Constant: +40 ppm/°C
- Thermal Conductivity: 0.71 W/m/°K
- Low Moisture Absorption: 0.06%
The material's thermal expansion characteristics align closely with copper, facilitating reliable plated through-hole quality.
Benefits
Rogers RO4003C offers numerous benefits, including:
- Ideal for multi-layer board constructions
- Lower fabrication costs compared to standard materials like FR-4
- Designed for performance-sensitive, high-volume applications
- Competitively priced, making it a popular choice
Typical Applications
RO4003C PCB is suitable for various applications, including:
- Cellular base station antennas and power amplifiers
- RF identification tags
- Automotive radar and sensors
- LNBs for direct broadcast satellites
Conclusion
The 3-layer PCB constructed with RO4003C and RO4450F materials exemplifies advanced engineering and design, making it ideal for demanding applications in telecommunications, automotive, and aerospace industries. Its combination of high performance, cost-effectiveness, and reliability ensures it meets the needs of modern electronics.
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3-Layer RO4003C PCB 1.8mm Thick with Blind Vias Images
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