Introduction to TLX-8 Material
TLX-8 is a high-volume antenna material composed of PTFE fiberglass laminates, specifically designed for reliable performance in a broad range of RF applications. Its versatility comes from various thickness options and copper cladding types, making it ideal for low layer count microwave designs. TLX-8 demonstrates mechanical reinforcement in severe environments, including:
- High vibration during space launches
- High temperature exposure in engine modules
- Radiation resistance for space applications
- Extreme conditions at sea for naval antennas
- Wide temperature ranges for altimeter substrates during flight
PCB Stack-up
The stackup of the PCB consists of:
- Copper Layer 1: 35 μm
- Taconic TLX-8 Core: 0.254 mm (10 mil)
- Copper Layer 2: 35 μm
PCB Details
| Parameter | Specification |
| Base Material | TLX-8 |
| Layer Count | 2 Layers |
| Board Dimensions | 20mm x 21.35mm ± 0.15mm |
| Minimum Trace/Space | 5/6 mils |
| Minimum Hole Size | 0.2mm |
| Blind Vias | No |
| Finished Board Thickness | 0.3mm |
| Finished Cu Weight | 1oz (1.4 mils) for outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Testing | 100% electrical test prior to shipment |
Quality Standards and Availability
This PCB adheres to IPC-Class-2 quality standards and is available for purchase worldwide.
Benefits of TLX-8 PCBs
- Excellent PIM Values: Measured below -160 dBc
- Mechanical & Thermal Properties: Outstanding performance in challenging environments
- Low and Stable Dielectric Constant (Dk): Provides consistent electrical performance
- Dimensionally Stable: Maintains form factor under various conditions
- Low Moisture Absorption: Enhances durability and reliability
- Tightly Controlled Dk: Ensures predictable performance
- Low Dissipation Factor (DF): Minimizes signal loss
- UL 94 V0 Rating: High flammability resistance
- Ideal for Low Layer Count Microwave Designs: Perfect for advanced RF applications
Electrical Properties
- Dielectric Constant @ 10 GHz: 2.55 ± 0.04
- Dissipation Factor @ 10 GHz: 0.0018
- Surface Resistivity (Elevated Temp): 6.605 x 10^8 Mohm
- Surface Resistivity (Humidity Conditions): 3.550 x 10^6 Mohm
- Volume Resistivity (Elevated Temp): 1.110 x 10^10 Mohm/cm
- Volume Resistivity (Humidity Conditions): 1.046 x 10^10 Mohm/cm
Dimensional Stability
- MD After Bake: 0.06 mm/M
- CD After Bake: 0.08 mm/M
- MD Thermal Stress: 0.09 mm/M
- CD Thermal Stress: 0.10 mm/M
Coefficient of Thermal Expansion (CTE)
- X: 21 ppm/°C
- Y: 23 ppm/°C
- Z: 215 ppm/°C
Thermal Properties
- 2% Weight Loss: 535 °C
- 5% Weight Loss: 553 °C
Chemical and Physical Properties
- Moisture Absorption: 0.02%
- Dielectric Breakdown: > 45 kV
- Flammability Rating: V-0
Typical Applications
TLX-8 PCBs are suited for various applications, including:
- Radar systems
- Mobile communications
- Microwave test equipment
- Microwave transmission devices
- Couplers, splitters, combiners, amplifiers, and antennas
With its robust construction and exceptional properties, TLX-8 is the material of choice for high-performance PCBs in demanding RF environments.
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TLX-8 PCB 2-Layer 10mil Substrate ENIG Finish for RF Applications Images
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